
Boom in Fintech Bond Sale Platforms Risks Fragmenting Market – Bloomberg
December 4, 2020 \
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Full Article: Bloomberg
The concerns follow a flurry of new technologies from New York to Hong Kong trying to drag the process of placing bonds into the 21st century. There are now at least 35 different systems for new bond deals across the globe, up from 22 in 2018, according to data from the International Capital Market Association.
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